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OP213ESZ-REEL - Analog Devices

Description: General Purpose Amplifier 2 Circuit Rail-to-Rail 8-SOIC ,1.2V/µs ,240 nA ,100 µV ,40 mA ,4 V ,-40°C ~ 85°C

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OP213ESZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - (R-8)
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OP213ESZ-REEL Details

  • Manufacturer Part Number:

    OP213ESZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.7 µA

  • Bias Current-Max (IIB) @25C:

    0.65 µA

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    116 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    YES

  • Programmable Power:

    YES

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    0.6 V/us

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3400

  • Voltage Gain-Min:

    2000000

  • Wideband:

    YES

  • Width:

    3.9 mm

OP213ESZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the OP213ESZ-REEL involves keeping the input and output traces short and away from each other, using a solid ground plane, and decoupling the power supply pins with capacitors. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation capacitor values and placement, keep the input and output impedance low, and avoid capacitive loading on the output. Also, use a low-ESR capacitor for decoupling and keep the power supply noise low.
  • The maximum power dissipation of the OP213ESZ-REEL is dependent on the ambient temperature and the package type. For the SOIC package, the maximum power dissipation is 670mW at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the operating temperature and other environmental factors.
  • The OP213ESZ-REEL is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the power dissipation and ensure proper heat sinking to maintain a safe operating temperature.
  • To protect the OP213ESZ-REEL from ESD damage, use ESD-safe handling and storage procedures, and consider adding ESD protection devices such as TVS diodes or ESD protection arrays to the PCB design. Also, ensure that the PCB has a solid ground plane and is properly grounded.

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OP213ESZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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