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OPA137NA/3K - Texas Instruments

Description: Low Cost FET-Input Operational Amplifiers

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OPA137NA/3K - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - OPA137NA/3K
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OPA137NA/3K - Texas Instruments  - 3D model - SOT23 (5-Pin) - OPA137NA/3K
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OPA137NA/3K Details

  • Manufacturer Part Number:

    OPA137NA/3K

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China, Malaysia, Mexico, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    3.5 V/us

  • Supply Current-Max:

    0.27 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIFET

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    20000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA137NA/3K Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA137NA/3K involves keeping the input and output traces short and away from each other, using a ground plane, and placing decoupling capacitors close to the power pins.
  • Choose gain resistors based on the desired gain and bandwidth. A good starting point is to use the values recommended in the datasheet, and then adjust them based on your specific application requirements.
  • The maximum power dissipation of OPA137NA/3K is 670mW. Make sure to calculate the power dissipation in your application and ensure it is within this limit to avoid overheating.
  • OPA137NA/3K is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consider using a heat sink or reducing the power dissipation to ensure reliable operation.
  • Use shielding, filtering, and grounding techniques to protect OPA137NA/3K from EMI. Keep the device away from sources of electromagnetic radiation, and use a metal shield or screen to enclose the circuit.

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OPA137NA/3K Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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