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OPA170AIDBVT - Texas Instruments

Description: 36V, microPower, Rail-to-Rail Output, General Purpose Op Amp in MicroPackages

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PCB Footprints
OPA170AIDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV-SOT23
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OPA170AIDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV-SOT23
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OPA170AIDBVT Details

  • Manufacturer Part Number:

    OPA170AIDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0035 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.145 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA170AIDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA170AIDBVT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, ensure that the feedback loop has a sufficient phase margin and gain margin.
  • While the OPA170AIDBVT can be used as a comparator, it's not the most suitable choice. The device is designed as a general-purpose op-amp, and its performance may not be optimized for comparator applications. If you need a comparator, consider using a dedicated comparator IC.
  • For optimal performance, follow the recommended layout and routing guidelines in the datasheet, including keeping the input and output traces short and symmetrical, using a ground plane, and minimizing noise coupling.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body, use an ESD wrist strap or mat, and ensure that your workspace is ESD-protected. Additionally, consider using ESD protection devices, such as TVS diodes, in your circuit design.

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OPA170AIDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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