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OPA170AQDBVRQ1 - Texas Instruments

Description: Automotive 36V, microPower, Rail-to-Rail Output, General Purpose Op Amp in MicroPackages

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OPA170AQDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23-5
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OPA170AQDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - SOT-23-5
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OPA170AQDBVRQ1 Details

  • Manufacturer Part Number:

    OPA170AQDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -2 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.155 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    316227.76

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA170AQDBVRQ1 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA170AQDBVRQ1 is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, consider using a phase margin analyzer tool to verify stability.
  • For optimal performance, keep the input and output traces short and symmetrical, avoid crossing signal traces, and use a solid ground plane. Also, place decoupling capacitors close to the op-amp's power pins and use a low-ESR capacitor for the bypass capacitor.
  • The OPA170AQDBVRQ1 is specified to operate from -40°C to 125°C. However, the device's performance may degrade at higher temperatures. Consult the datasheet for temperature-related specifications and consider using thermal management techniques if operating in high-temperature environments.
  • To minimize EMI, use a shielded enclosure, keep the op-amp and surrounding components away from high-frequency sources, and use EMI filters or shielding on the input and output lines. Additionally, consider using a common-mode choke or ferrite beads to reduce EMI.

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OPA170AQDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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