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OPA172IDCKR - Texas Instruments

Description: General Purpose Amplifiers General Purpose 1 4.5V ~ 36V, ±2.25V ~ 18V 10MHz 10 V/us SC-70-5 RoHS

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PCB Footprints
OPA172IDCKR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK
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3D Models
OPA172IDCKR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK
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OPA172IDCKR Details

  • Manufacturer Part Number:

    OPA172IDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.014 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.001 µA

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    10 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    1.25 mm

OPA172IDCKR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA172IDCKR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, use a low-ESR capacitor for decoupling, and avoid capacitive loads. Additionally, consider using a series resistor and capacitor (RC) snubber network to reduce oscillations.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 1μF. However, the optimal capacitance values may vary depending on the specific application and layout.
  • The OPA172IDCKR is specified to operate from -40°C to 125°C. However, the device's performance may degrade at higher temperatures. It's essential to consider the thermal management and heat dissipation in your design to ensure reliable operation.
  • To reduce noise and EMI, use proper shielding, grounding, and layout techniques. Keep the input and output traces short, and use a ground plane to reduce radiation. Additionally, consider using a common-mode choke or ferrite beads to filter out high-frequency noise.

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OPA172IDCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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