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OPA182IDBVR - Texas Instruments

Description: Precision Amplifiers Highest-precision, 36-V, 5-MHz, single, low-noise, zero-drift, MUX-friendly amplifier

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PCB Footprints
OPA182IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA182IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA182IDBVR Details

  • Manufacturer Part Number:

    OPA182IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.007 µA

  • Bias Current-Max (IIB) @25C:

    0.00035 µA

  • Common-mode Reject Ratio-Min:

    141 dB

  • Common-mode Reject Ratio-Nom:

    168 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    20 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5000

  • Voltage Gain-Min:

    31622776

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA182IDBVR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout, with the op-amp's ground pin connected to a central ground point, and the use of bypass capacitors between the power supply pins and ground to reduce noise and oscillations.
  • The output capacitor should be chosen based on the desired closed-loop bandwidth and stability requirements. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, and a voltage rating that exceeds the maximum output voltage of the op-amp.
  • The maximum power dissipation of the OPA182IDBVR is dependent on the ambient temperature and the package thermal resistance. The power dissipation can be calculated using the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • Yes, the OPA182IDBVR can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is high enough to avoid loading the source, and that the output impedance is low enough to drive the load. Additionally, the op-amp's bandwidth and slew rate should be sufficient to handle the input signal frequency and amplitude.
  • To protect the OPA182IDBVR from EMI and RFI, use shielding, filtering, and grounding techniques. Place the op-amp in a shielded enclosure, use ferrite beads or chokes to filter out high-frequency noise, and ensure that the PCB layout is designed to minimize radiation and susceptibility to external interference.

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OPA182IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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