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OPA188AQDGKRQ1 - Texas Instruments

Description: Automotive-Qualified Precision, Low-Noise, RRO, 36V, Zero-Drift Operational Amplifier

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OPA188AQDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA188AQDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA188AQDGKRQ1 Details

  • Manufacturer Part Number:

    OPA188AQDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0014 µA

  • Bias Current-Max (IIB) @25C:

    0.0014 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    126 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.006 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.8 V/us

  • Supply Current-Max:

    0.51 mA

  • Supply Voltage Limit-Max:

    20 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3 mm

OPA188AQDGKRQ1 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. Additionally, the TI website has a PCB layout tool that can help with designing a layout for the OPA188AQDGKRQ1.
  • The OPA188AQDGKRQ1 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat when handling the device, and store it in an anti-static bag or container.
  • The maximum power dissipation for the OPA188AQDGKRQ1 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated at higher temperatures. Consult the datasheet for more information.
  • The OPA188AQDGKRQ1 is rated for operation from -40°C to 125°C, but its performance may degrade at higher temperatures. Consult the datasheet for temperature-related specifications and consider using a heat sink or thermal management system if operating in a high-temperature environment.
  • The output capacitor should be chosen based on the desired frequency response, output impedance, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10nF and 100nF, but consult the datasheet and application notes for more specific guidance.

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OPA188AQDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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