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OPA192IDGKR - Texas Instruments

Description: High-Voltage, Rail-to-Rail Input/Output, 5µV, 0.2µV/˚C, Precision Operational Amplifier

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OPA192IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA192IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA192IDGKR Details

  • Manufacturer Part Number:

    OPA192IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.002 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

OPA192IDGKR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA192IDGKR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's recommended to use a compensation capacitor (CF) between the output and the inverting input pins. The value of CF depends on the gain and bandwidth requirements of the application. A good starting point is a 10pF to 22pF capacitor.
  • To minimize noise and EMI, it's recommended to use a star-ground configuration, keep the input and output traces short and away from each other, and use a ground plane to shield the op-amp. Additionally, decoupling capacitors should be placed close to the op-amp's power pins.
  • Yes, the OPA192IDGKR can be used in a single-supply configuration. However, the input common-mode voltage range is limited to VCC-1.5V to VCC+0.5V. To ensure proper operation, the input signal should be biased within this range.
  • The feedback resistor values (R1 and R2) should be chosen based on the desired gain and bandwidth requirements. A good starting point is to use a ratio of R2/R1 = gain-1. The absolute values of R1 and R2 should be chosen to minimize noise and ensure stability.

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OPA192IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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