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OPA192IDR - Texas Instruments

Description: High-Voltage, Rail-to-Rail Input/Output, 5µV, 0.2µV/˚C, Precision Operational Amplifier

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OPA192IDR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G)
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OPA192IDR - Texas Instruments  - 3D model - Small Outline Packages - D(R-PDSO-G)
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OPA192IDR Details

  • Manufacturer Part Number:

    OPA192IDR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.002 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.2 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.91 mm

OPA192IDR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA192IDR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability in a unity-gain configuration, add a 10-22 ohm resistor in series with the output, and a 10-100 pF capacitor in parallel with the output. This helps to reduce ringing and oscillations.
  • The OPA192IDR can drive up to 1 nF of capacitive load. However, it's recommended to limit the capacitive load to 100 pF or less to ensure stability and prevent oscillations.
  • To reduce noise and EMI, use a low-ESR decoupling capacitor (e.g., 10 uF ceramic) close to the device, and add a 10-100 ohm series resistor to the input. Also, use a shielded cable or twisted pair for input and output connections.
  • The recommended power-on sequence for OPA192IDR is to apply the power supply voltage (VCC) before applying the input signal. This helps to prevent latch-up and ensures proper device operation.

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OPA192IDR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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