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OPA197IDGKT - Texas Instruments

Description: 36-V, Precision, Rail-to-Rail Input Output, Low Offset Voltage Op Amp

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OPA197IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK-1
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OPA197IDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK-1
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OPA197IDGKT Details

  • Manufacturer Part Number:

    OPA197IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    100 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    1.3 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3 mm

OPA197IDGKT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic capacitance and inductance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended compensation capacitor values and placement, as well as to maintain a minimum gain of 5V/V. Additionally, the input and output impedance should be matched, and the feedback network should be designed to minimize phase shift and ensure a stable phase margin.
  • The maximum power dissipation of OPA197IDGKT is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where Pd is the power dissipation, TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance. The recommended maximum power dissipation is 1.4W.
  • Yes, OPA197IDGKT is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to follow the recommended operating conditions and to ensure proper thermal management to prevent overheating.
  • To protect OPA197IDGKT from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter or a shielded cable to reduce radiated emissions.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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