SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Power:
NO
Programmable Power:
NO
Seated Height-Max:
1.45 mm
Slew Rate-Nom:
2.7 V/us
Supply Current-Max:
0.375 mA
Supply Voltage Limit-Max:
18 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
Terminal Form:
GULL WING
Terminal Pitch:
0.95 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Unity Gain BW-Nom:
1300
Voltage Gain-Min:
1000000
Wideband:
NO
Width:
1.65 mm
OPA207IDBVT Frequently Asked Questions (FAQs)
Texas Instruments recommends a layout that minimizes parasitic capacitance and inductance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated analog ground plane is recommended.
To ensure stability, ensure that the circuit has a sufficient phase margin, and the gain-bandwidth product is not exceeded. Use a compensation capacitor (if required) and ensure that the output impedance is low enough to prevent oscillations. Also, avoid using long input traces and keep the feedback network as simple as possible.
The maximum power dissipation of OPA207IDBVT is 500mW. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current. Ensure that the calculated power dissipation is within the recommended limit to prevent overheating.
Yes, OPA207IDBVT can be used in high-temperature environments, but with some limitations. The device is specified to operate up to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. At higher temperatures, the device's performance may degrade, and the lifespan may be reduced. Ensure that the device is properly heatsinked and the thermal design is adequate to prevent overheating.
To protect OPA207IDBVT from EMI and RFI, use a shielded enclosure, keep the input and output traces short and away from noise sources, and use a common-mode choke or ferrite bead to filter out high-frequency noise. Also, ensure that the PCB layout is designed to minimize radiation and susceptibility to external interference.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
OPA207IDBVT Overview
Use the download button to access the OPA207IDBVT schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like OPA20,
or try a keyword search, such as Operational Amplifiers
About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
