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OPA211IDGKR - Texas Instruments

Description: Op Amp Single Low Power Amplifier R-R O/P ±18V/36V 8-Pin VSSOP T/R

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OPA211IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA211IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA211IDGKR Details

  • Manufacturer Part Number:

    OPA211IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.125 µA

  • Bias Current-Max (IIB) @25C:

    0.125 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.1 µA

  • Input Offset Voltage-Max:

    50 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    27 V/us

  • Supply Current-Max:

    4.5 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    45000

  • Voltage Gain-Min:

    316000

  • Wideband:

    YES

  • Width:

    3 mm

OPA211IDGKR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA211IDGKR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-22pF) between the output and the inverting input pins to compensate for the op-amp's internal capacitance and ensure stability.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces separate, using a solid ground plane, and placing decoupling capacitors close to the op-amp's power pins.
  • The OPA211IDGKR is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate in a high-temperature environment, consider using a more temperature-resistant op-amp or taking additional thermal management measures.
  • Choose resistors and capacitors that meet the op-amp's recommended impedance and frequency response requirements. For example, use 1% or 0.1% resistors and NP0 or C0G capacitors to minimize temperature coefficient and parasitic effects.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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