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OPA2137EA/250G4 - Texas Instruments

Description: Operational Amplifiers - Op Amps Low Cost FET-Input Oper Amplifier

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OPA2137EA/250G4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2137EA/250G4 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2137EA/250G4 Details

  • Manufacturer Part Number:

    OPA2137EA/250G4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    GREEN, MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.0001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    84 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    3.5 V/us

  • Supply Current-Max:

    0.54 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    20000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2137EA/250G4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability in a unity-gain configuration, use a compensation capacitor (typically 10-22pF) between the output and the inverting input pins. This helps to reduce the phase shift and ensure stability.
  • The maximum power dissipation of OPA2137EA/250G4 is 670mW. However, this can be limited by the thermal resistance of the package and the PCB, so it's essential to ensure proper thermal management.
  • Yes, OPA2137EA/250G4 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • To protect OPA2137EA/250G4 from ESD damage, use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Additionally, follow proper handling and storage procedures to prevent ESD damage.

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OPA2137EA/250G4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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