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OPA2170AIDCUT - Texas Instruments

Description: 36V, microPower, Rail-to-Rail Output, Dual, General Purpose Op Amp in microPackage

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OPA2170AIDCUT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCU (R-PDSO-G8)
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OPA2170AIDCUT - Texas Instruments  - 3D model - Small Outline Packages - DCU (R-PDSO-G8)
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OPA2170AIDCUT Details

  • Manufacturer Part Number:

    OPA2170AIDCUT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0035 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.29 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1200

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    2 mm

OPA2170AIDCUT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA2170AIDCUT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability in a unity-gain configuration, it's recommended to add a capacitor (typically 10-22pF) between the output and the inverting input pins to compensate for the op-amp's internal capacitance and ensure stability.
  • To minimize noise and EMI, it's recommended to follow good PCB layout practices, such as keeping the input and output traces short and away from each other, using a solid ground plane, and avoiding routing signals near the op-amp's inputs and outputs.
  • The OPA2170AIDCUT is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate the op-amp in a high-temperature environment, consider using a heat sink or a thermally-enhanced package.
  • When choosing resistors for the feedback network, consider the op-amp's input impedance, output impedance, and desired gain. Use resistors with a low temperature coefficient (TCR) and a high power rating to minimize noise and ensure stability.

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OPA2170AIDCUT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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