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OPA2171AID - Texas Instruments

Description: 36V, Low Power, RRO, General Purpose Operational Amplifier in MicroPackages

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OPA2171AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - SOIC - 1.75
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OPA2171AID - Texas Instruments  - 3D model - Small Outline Packages - SOIC - 1.75
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OPA2171AID Details

  • Manufacturer Part Number:

    OPA2171AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0035 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    104 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0035 µA

  • Input Offset Voltage-Max:

    1800 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -18 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.19 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    18 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA2171AID Frequently Asked Questions (FAQs)

  • The maximum power dissipation of OPA2171AID is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To minimize noise and ensure optimal performance, it is recommended to follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping the input and output traces short and symmetrical.
  • The recommended capacitor value for decoupling the power supply is 0.1uF to 1uF, depending on the specific application and noise requirements. A larger capacitor value can help to further reduce noise and ripple.
  • Yes, OPA2171AID can be used as a unity-gain buffer. The device has a high input impedance and a low output impedance, making it suitable for buffering applications. However, it's recommended to check the stability and phase margin of the circuit to ensure oscillation-free operation.
  • To handle ESD protection for OPA2171AID, it is recommended to use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection device at the input pins. Additionally, following good PCB design practices such as using a solid ground plane and minimizing trace lengths can help to reduce ESD susceptibility.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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