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OPA2192QDGKRQ1 - Texas Instruments

Description: Automotive 36-V, Precision, RRIO, Low Offset Voltage, Low Input Bias Current Op Amp With e-trim

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OPA2192QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK (S-PDSO-G8)
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OPA2192QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK (S-PDSO-G8)
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OPA2192QDGKRQ1 Details

  • Manufacturer Part Number:

    OPA2192QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-05-25

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00002 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    120 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.002 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    2.4 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2192QDGKRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2192QDGKRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a compensation capacitor (e.g., 10nF to 100nF) between the output and the inverting input. Additionally, use a low-ESR capacitor (e.g., 10uF to 100uF) between the power supply pins and ground. Avoid using long input traces and keep the feedback network impedance low.
  • The maximum power dissipation of OPA2192QDGKRQ1 is 1.4W. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout). Ensure that the device is properly heat-sinked and the PCB is designed for good thermal dissipation.
  • Yes, OPA2192QDGKRQ1 can be used in a single-supply configuration. However, the input common-mode voltage range is limited to Vcc-1.5V to Vcc+0.5V. Use a voltage divider or a resistive network to level-shift the input signal to within the allowed common-mode range.
  • Use ESD protection diodes (e.g., TVS diodes) on the input and output pins. Add a series resistor (e.g., 1kΩ) between the input and the device to limit the input current. For overvoltage protection, use a voltage clamp or a zener diode to limit the voltage to within the absolute maximum ratings.

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OPA2192QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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