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OPA2197QDGKRQ1 - Texas Instruments

Description: Dual automotive 36-V, precision, rail-to-rail input output, low offset voltage op amp

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OPA2197QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2197QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2197QDGKRQ1 Details

  • Manufacturer Part Number:

    OPA2197QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-03-23

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.005 µA

  • Bias Current-Max (IIB) @25C:

    0.00002 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    140 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    250 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    20 V/us

  • Supply Current-Max:

    2.6 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    501187.22

  • Wideband:

    NO

  • Width:

    3 mm

OPA2197QDGKRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2197QDGKRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. A good starting point is to use the gain resistor values recommended in the datasheet. For custom gains, use the gain equation provided in the datasheet and consider the trade-offs between gain, bandwidth, and noise.
  • The maximum power dissipation of OPA2197QDGKRQ1 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, this value can be derated for higher ambient temperatures.
  • To protect OPA2197QDGKRQ1 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, use a low-pass filter or a shielding material to reduce radiated emissions.
  • The recommended input capacitance is 10nF to 100nF, and the recommended output capacitance is 10nF to 1uF. However, the optimal capacitance values depend on the specific application and the desired frequency response.

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OPA2197QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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