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OPA2209AID - Texas Instruments

Description: Precision Amplifiers Low Noise,Low Power 36V,Op Amp

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OPA2209AID - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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OPA2209AID - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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OPA2209AID Details

  • Manufacturer Part Number:

    OPA2209AID

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.015 µA

  • Bias Current-Max (IIB) @25C:

    0.0045 µA

  • Common-mode Reject Ratio-Min:

    120 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.015 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -20 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    6.4 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    20 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    18000

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA2209AID Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2209AID involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain resistor (Rg) is less than or equal to 1 kΩ, and the feedback capacitor (Cf) is less than or equal to 10 pF. Also, use a low-ESR capacitor for decoupling and keep the layout compact.
  • The maximum power dissipation of OPA2209AID is 670 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. Ensure that the device is properly heat-sinked and operated within the recommended temperature range.
  • Yes, OPA2209AID can be used in a single-supply configuration. However, the input common-mode voltage range is limited to VCC-1.5V to VCC+0.5V. Ensure that the input signal is within this range to maintain optimal performance.
  • To reduce noise and EMI, use a low-noise power supply, decouple the device with low-ESR capacitors, and use a shielded enclosure. Also, keep the input and output traces away from each other and from other noisy signals.

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OPA2209AID Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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