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OPA2237EA/250 - Texas Instruments

Description: Texas Instruments OPA2237EA/250, Dual Op Amp, 1.4MHz, 5 V, 8-Pin MSOP

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OPA2237EA/250 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2237EA/250 - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2237EA/250 Details

  • Manufacturer Part Number:

    OPA2237EA/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.04 µA

  • Bias Current-Max (IIB) @25C:

    0.04 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.01 µA

  • Input Offset Voltage-Max:

    950 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.95 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2237EA/250 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of OPA2237EA/250 is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, such as keeping the input and output traces short and away from each other, using a solid ground plane, and decoupling the power supply with a 10uF capacitor.
  • The recommended input capacitance for OPA2237EA/250 is 10pF to 100pF, depending on the specific application and noise requirements. A larger input capacitance can help filter out high-frequency noise, but may also increase the settling time.
  • Yes, OPA2237EA/250 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to avoid signal attenuation. Additionally, the output impedance should be considered when driving a load.
  • To handle ESD protection for OPA2237EA/250, it's recommended to use a TVS (Transient Voltage Suppressor) diode or a dedicated ESD protection device, such as the Texas Instruments TPD2E001, in conjunction with proper PCB layout and handling practices.

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OPA2237EA/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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