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OPA2316QDGKRQ1 - Texas Instruments

Description: Automotive 10MHz, Rail-to-Rail Input/Output, Low-Voltage 1.8V CMOS Operational Amplifier

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OPA2316QDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK-08
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OPA2316QDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - DGK-08
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OPA2316QDGKRQ1 Details

  • Manufacturer Part Number:

    OPA2316QDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2017-01-04

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.015 µA

  • Bias Current-Max (IIB) @25C:

    0.000015 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    6 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2316QDGKRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2316QDGKRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain and phase margins are sufficient, and the circuit is properly compensated. Use a capacitor in the feedback path to reduce the gain at high frequencies, and add a series resistor to the feedback path to reduce the Q of the circuit.
  • The maximum power dissipation of OPA2316QDGKRQ1 is 670mW. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • Yes, OPA2316QDGKRQ1 is rated for operation from -40°C to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C.
  • To protect OPA2316QDGKRQ1 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead in the power supply lines. Additionally, use a low-pass filter in the input and output stages to reduce high-frequency noise.

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OPA2316QDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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