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OPA2333AQDGKRQ1 - Texas Instruments

Description: Automotive catalog 1.8V, 17uA, 2uV, microPOWER CMOS Zero-Drift Series Operational Amplifier

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OPA2333AQDGKRQ1 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - VSSOP
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OPA2333AQDGKRQ1 - Texas Instruments  - 3D model - Small Outline Packages - VSSOP
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OPA2333AQDGKRQ1 Details

  • Manufacturer Part Number:

    OPA2333AQDGKRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    102 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.16 V/us

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    158000

  • Wideband:

    NO

  • Width:

    3 mm

OPA2333AQDGKRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2333AQDGKRQ1 involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a compensation capacitor (e.g., 10nF to 100nF) between the output and the inverting input. Additionally, use a low-ESR capacitor (e.g., 10uF to 100uF) between the power supply and ground. Keep the feedback network impedance low and avoid capacitive loads.
  • The maximum power dissipation of OPA2333AQDGKRQ1 is 670mW. However, this value can be limited by the thermal resistance of the package and the PCB. Ensure proper thermal design and heat sinking to prevent overheating.
  • Yes, OPA2333AQDGKRQ1 can be used as a unity-gain buffer. However, ensure that the input impedance is high enough to prevent loading effects. A resistor in series with the input can help improve stability.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI and RFI. Keep the analog circuitry away from digital circuits, and use ferrite beads or common-mode chokes to filter out high-frequency noise.

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OPA2333AQDGKRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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