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OPA2338UA - Texas Instruments

Description: Texas Instruments OPA2338UA, Dual Op Amp, 12.5MHz CMOS, Rail to Rail, 3 V, 5 V, 8-Pin SOIC

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OPA2338UA - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G)
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OPA2338UA - Texas Instruments  - 3D model - Small Outline Packages - D(R-PDSO-G)
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OPA2338UA Details

  • Manufacturer Part Number:

    OPA2338UA

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES (AVCL>=5)

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    4.6 V/us

  • Supply Current-Max:

    2 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    12500

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA2338UA Frequently Asked Questions (FAQs)

  • Texas Instruments recommends following a star-grounding layout, keeping the input and output traces short and away from each other, and placing the device close to the signal source. Additionally, using a ground plane and decoupling capacitors can help reduce noise and improve performance.
  • The gain resistors should be chosen based on the desired gain and bandwidth requirements. A higher gain resistor value will result in a higher gain, but may also reduce the bandwidth. Texas Instruments provides a gain resistor calculator tool to help with selection. It's also important to consider the resistor's tolerance, temperature coefficient, and parasitic capacitance when making a selection.
  • The maximum power dissipation of the OPA2338UA is dependent on the ambient temperature and the thermal resistance of the package. The datasheet provides a power dissipation calculator, and Texas Instruments recommends following the thermal design guidelines to ensure the device operates within safe limits.
  • To protect the OPA2338UA from EMI and RFI, use shielding, filtering, and grounding techniques. Place the device in a shielded enclosure, use ferrite beads or chokes on the input and output lines, and ensure a low-impedance ground connection. Additionally, use a common-mode filter or a differential filter to reject common-mode noise.
  • The OPA2338UA is rated for operation up to 125°C, but the device's performance and reliability may degrade at higher temperatures. To ensure reliability, follow the recommended operating conditions, use a heat sink if necessary, and consider using a thermally enhanced package. Additionally, perform thermal simulations and testing to validate the design.

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OPA2338UA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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