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OPA2364IDGKT - Texas Instruments

Description: 1.8V, High CMR, RRIO Op Amp

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OPA2364IDGKT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2364IDGKT - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2364IDGKT Details

  • Manufacturer Part Number:

    OPA2364IDGKT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    19950

  • Wideband:

    NO

  • Width:

    3 mm

OPA2364IDGKT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA2364IDGKT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's recommended to use a gain resistor (RG) of at least 1kΩ and a capacitor (CF) of at least 10pF in parallel with RG. Additionally, the feedback resistor (RF) should be less than or equal to 2kΩ.
  • For optimal performance, it's recommended to use a star-grounding technique, where the analog and digital grounds are separated and connected at a single point. Additionally, keep the input and output traces short and away from noise sources, and use a solid ground plane to reduce electromagnetic interference (EMI).
  • The OPA2364IDGKT is specified to operate from -40°C to 125°C, but it's recommended to derate the power dissipation at higher temperatures to ensure reliability. Consult the datasheet for thermal derating information.
  • The output capacitor (CO) should be chosen based on the desired closed-loop bandwidth and stability. A general rule of thumb is to use a capacitor with a value of at least 10 times the feedback capacitor (CF) value.

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OPA2364IDGKT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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