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OPA237NA/250 - Texas Instruments

Description: Texas Instruments OPA237NA/250 Op Amp, 1.4MHz, 5 V, 5-Pin SOT-23

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PCB Footprints
OPA237NA/250 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23-
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3D Models
OPA237NA/250 - Texas Instruments  - 3D model - SOT23 (5-Pin) - SOT-23-
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OPA237NA/250 Details

  • Manufacturer Part Number:

    OPA237NA/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.04 µA

  • Bias Current-Max (IIB) @25C:

    0.04 µA

  • Common-mode Reject Ratio-Min:

    80 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.01 µA

  • Input Offset Voltage-Max:

    950 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -18 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.475 mA

  • Supply Voltage Limit-Max:

    18 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA237NA/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for the OPA237NA/250 involves keeping the input and output traces short and away from each other, using a ground plane, and placing decoupling capacitors close to the power pins. A 4-layer PCB with a dedicated ground plane is recommended.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. A good starting point is to use the gain resistor calculator tool provided by Texas Instruments or to consult the application notes for guidance.
  • The maximum power dissipation of the OPA237NA/250 is 670mW. However, this can be limited by the thermal resistance of the package and the PCB. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, the OPA237NA/250 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance to prevent signal attenuation.
  • To reduce noise and EMI, use proper shielding, keep the circuit layout compact, and use decoupling capacitors. Additionally, consider using a common-mode filter or a ferrite bead to reduce high-frequency noise.

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OPA237NA/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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