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OPA2652E/250 - Texas Instruments

Description: Texas Instruments OPA2652E/250, Dual Op Amp, 200MHz, 9 V, 8-Pin SOT-23

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PCB Footprints
OPA2652E/250 - Texas Instruments PCB footprint - SOT23 (8-Pin) - SOT23 (8-Pin) - DCN (R-PDSO-G8)
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3D Models
OPA2652E/250 - Texas Instruments  - 3D model - SOT23 (8-Pin) - DCN (R-PDSO-G8)
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OPA2652E/250 Details

  • Manufacturer Part Number:

    OPA2652E/250

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    25 µA

  • Bias Current-Max (IIB) @25C:

    15 µA

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    1 µA

  • Input Offset Voltage-Max:

    7000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSSOP8,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    335 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    13.2 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    700000

  • Voltage Gain-Min:

    500

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA2652E/250 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA2652E/250 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. A 4-layer PCB with a dedicated ground plane is recommended.
  • The gain resistors (Rf and Rg) should be chosen based on the desired gain and bandwidth. A higher gain requires smaller resistors, while a higher bandwidth requires larger resistors. TI provides a gain resistor calculator tool to help with the selection.
  • The maximum power dissipation of OPA2652E/250 is 1.4W. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
  • Yes, OPA2652E/250 can be used as a unity-gain buffer by connecting the output directly to the inverting input and using a gain resistor (Rf) of 0 ohms. However, this configuration may not provide the best noise performance.
  • OPA2652E/250 has a built-in filter capacitor (Cf) that can be used to filter out high-frequency noise. Additionally, external filters such as RC filters or ferrite beads can be used to further reduce noise.

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OPA2652E/250 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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