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OPA2992IDGKR - Texas Instruments

Description: Operational Amplifiers - Op Amps Dual, 40-V, 10-MHz, low-power operational amplifier

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OPA2992IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2992IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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OPA2992IDGKR Details

  • Manufacturer Part Number:

    OPA2992IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    75 dB

  • Common-mode Reject Ratio-Nom:

    115 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    32 V/us

  • Supply Current-Max:

    5.68 mA

  • Supply Voltage Limit-Max:

    42 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    10600

  • Voltage Gain-Min:

    158489.3192

  • Wideband:

    NO

  • Width:

    3 mm

OPA2992IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, keeps the input and output traces short and separate, and uses a solid ground plane to reduce noise and electromagnetic interference (EMI). A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a compensation capacitor (Cc) between the output and the inverting input, and a series resistor (Rs) at the output. The values of Cc and Rs depend on the specific application and can be calculated using the datasheet's stability analysis guidelines. Additionally, ensure that the circuit's gain and phase margins are sufficient.
  • The maximum power dissipation of OPA2992IDGKR is limited by its junction temperature (TJ) and thermal resistance (θJA). Calculate the maximum power dissipation using the formula: Pd(max) = (TJ(max) - TA) / θJA, where TA is the ambient temperature. Ensure that the device's power dissipation is within the recommended limits to prevent overheating and reliability issues.
  • OPA2992IDGKR is specified to operate from -40°C to 125°C. However, its performance may degrade at high temperatures, and the device's reliability may be affected. Consult the datasheet's thermal characteristics and reliability data to determine the device's suitability for your specific high-temperature application.
  • Use a combination of layout techniques, such as shielding, grounding, and filtering, to minimize EMI and RFI effects. Ensure that the device's inputs and outputs are properly terminated, and use bypass capacitors to filter out high-frequency noise. Additionally, consider using EMI filters or common-mode chokes to further reduce interference.

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OPA2992IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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