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OPA2994IDGKR - Texas Instruments

Description: Standard Amplifier 2 Circuit Single Ended, Rail-to-Rail 8-VSSOP

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PCB Footprints
OPA2994IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK0008A_2024
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OPA2994IDGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK0008A_2024
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OPA2994IDGKR Details

  • Manufacturer Part Number:

    OPA2994IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    1.5 µA

  • Bias Current-Max (IIB) @25C:

    1.5 µA

  • Common-mode Reject Ratio-Min:

    109 dB

  • Common-mode Reject Ratio-Nom:

    125 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2300 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    35 V/us

  • Supply Current-Max:

    4.46 mA

  • Supply Voltage Limit-Max:

    33 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    24000

  • Voltage Gain-Min:

    5623.413

  • Wideband:

    NO

  • Width:

    3 mm

OPA2994IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to minimize noise and distortion. A 4-layer PCB with a dedicated analog ground plane is recommended. Additionally, keep the input and output traces separate and avoid crossing them over each other.
  • The OPA2994IDGKR has internal ESD protection, but it's still recommended to add external ESD protection devices, such as TVS diodes or ESD arrays, to protect the device from external ESD events. Follow the recommended layout and handling procedures to minimize ESD risks.
  • The maximum power dissipation of OPA2994IDGKR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating temperature and thermal design.
  • The OPA2994IDGKR is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's performance and consider thermal management techniques, such as heat sinks or thermal interfaces, to ensure reliable operation in high-temperature environments.
  • The output capacitor selection depends on the desired closed-loop bandwidth, output impedance, and stability requirements. A general rule of thumb is to choose a capacitor with a value between 10nF to 100nF, with a low ESR (Equivalent Series Resistance) and a high ripple current rating. X7R or X5R ceramic capacitors are recommended for their low ESR and high reliability.

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OPA2994IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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