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OPA310IDCKR - Texas Instruments

Description: Operational Amplifiers - Op Amps Single, 5.5-V, 3-MHz high-output-current (150 mA) fast-shutdown (1 s) operational amplifier

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PCB Footprints
OPA310IDCKR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK0005A
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3D Models
OPA310IDCKR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK0005A
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OPA310IDCKR Details

  • Manufacturer Part Number:

    OPA310IDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00003 µA

  • Bias Current-Max (IIB) @25C:

    0.00003 µA

  • Common-mode Reject Ratio-Min:

    65 dB

  • Common-mode Reject Ratio-Nom:

    95 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    1300 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    3 V/us

  • Supply Current-Max:

    0.215 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    31622.7766

  • Wideband:

    NO

  • Width:

    1.25 mm

OPA310IDCKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a star-ground layout, with the op-amp's ground pin connected to a central ground point, and the use of separate analog and digital ground planes to minimize noise coupling. Additionally, keep the input and output traces short and away from noise sources.
  • The gain resistors (Rf and Rg) should be chosen based on the desired gain and bandwidth of the amplifier. A higher gain requires smaller resistors, but may also increase noise and reduce stability. TI provides a gain resistor calculator tool to help with this selection.
  • The maximum power dissipation of OPA310IDCKR is 1.4W. To ensure it doesn't overheat, ensure good thermal conductivity between the device and the PCB, use a heat sink if necessary, and keep the ambient temperature below 85°C. Also, calculate the power dissipation using the formula Pd = (Vcc x Icc) + (Vout x Iout) and ensure it's within the recommended limit.
  • Yes, OPA310IDCKR can be used as a unity-gain buffer. However, this configuration may reduce the amplifier's bandwidth and increase the noise. To minimize these effects, use a low-ESR capacitor in the feedback loop, and ensure the input impedance is low enough to prevent oscillations.
  • Use ESD protection diodes (e.g., TVS diodes) on the input and output pins to protect against electrostatic discharge. Additionally, use voltage limiting resistors or clamping diodes to prevent overvoltage events. TI also recommends using a voltage regulator to ensure a stable and regulated power supply.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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