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OPA313IDCKR - Texas Instruments

Description: 1-MHz, Micropower, Low-Noise, Rail-to-Rail I/O 1.8-V Operational Amplifier

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PCB Footprints
OPA313IDCKR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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3D Models
OPA313IDCKR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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OPA313IDCKR Details

  • Manufacturer Part Number:

    OPA313IDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Pin Count:

    5

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.5 V/us

  • Supply Current-Max:

    0.06 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    31622.776

  • Wideband:

    NO

  • Width:

    1.25 mm

OPA313IDCKR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA313IDCKR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain is set to a value that does not exceed the recommended maximum gain, and that the feedback resistors are chosen to minimize phase shift. Additionally, adding a capacitor in parallel with the feedback resistor can help improve stability.
  • The maximum power dissipation of OPA313IDCKR is 670mW. However, this value can be affected by the ambient temperature, PCB layout, and other factors. It's essential to calculate the power dissipation based on the specific application and ensure that it does not exceed the recommended maximum value.
  • OPA313IDCKR is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the temperature coefficient of the device and ensure that it meets the requirements of the application.
  • To protect OPA313IDCKR from EMI, use a shielded enclosure, keep the device away from sources of electromagnetic radiation, and use filtering components such as ferrite beads or common-mode chokes to reduce electromagnetic noise.

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OPA313IDCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Operational Amplifier, 1 Func, 2500uV Offset-Max, CMOS, PDSO5