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OPA317IDCKR - Texas Instruments

Description: Low Offset, Rail-to-Rail I/O Operational Amplifier

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PCB Footprints
OPA317IDCKR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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3D Models
OPA317IDCKR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK(R-PDSO-G5)
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OPA317IDCKR Details

  • Manufacturer Part Number:

    OPA317IDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0003 µA

  • Bias Current-Max (IIB) @25C:

    0.000275 µA

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    108 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    90 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.25 mm

OPA317IDCKR Frequently Asked Questions (FAQs)

  • The maximum power dissipation of OPA317IDCKR is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, such as minimizing parasitic capacitance and inductance, using a solid ground plane, and placing bypass capacitors close to the op-amp. Additionally, selecting the correct gain and bandwidth for your application can help prevent oscillations.
  • The recommended input voltage range for OPA317IDCKR is between 1.8V and 5.5V. Operating the device outside of this range may affect its performance and reliability.
  • While OPA317IDCKR is rated for operation up to 125°C, it's essential to consider the device's thermal limitations and potential degradation of performance at high temperatures. If your application requires operation above 85°C, consider using a thermally-enhanced package or a different op-amp designed for high-temperature operation.
  • When selecting an output capacitor, consider the op-amp's output impedance, the desired frequency response, and the capacitor's ESR (Equivalent Series Resistance). A general rule of thumb is to choose a capacitor with an ESR less than 5 ohms and a capacitance value between 10nF and 100nF.

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OPA317IDCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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