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OPA317QDBVRQ1 - Texas Instruments

Description: Automotive-Qualified Operational Amplifier with Low-Offset, RRIO, and Low Current Consumption

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OPA317QDBVRQ1 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - OPA317QDBVRQ1
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OPA317QDBVRQ1 - Texas Instruments  - 3D model - SOT23 (5-Pin) - OPA317QDBVRQ1
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OPA317QDBVRQ1 Details

  • Manufacturer Part Number:

    OPA317QDBVRQ1

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Philippines, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-07-28

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000155 µA

  • Common-mode Reject Ratio-Min:

    95 dB

  • Common-mode Reject Ratio-Nom:

    108 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    90 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.15 V/us

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    300

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA317QDBVRQ1 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA317QDBVRQ1 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, use a gain resistor (Rg) that is at least 1 kΩ, and a feedback capacitor (Cf) that is at least 10 pF. Additionally, ensure that the output impedance of the previous stage is low enough to drive the input of the OPA317QDBVRQ1.
  • The maximum power dissipation of OPA317QDBVRQ1 is 670 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. It's essential to calculate the power dissipation and ensure it's within the safe operating area.
  • While OPA317QDBVRQ1 is rated for operation up to 125°C, its performance may degrade at high temperatures. Ensure that the device is properly heat-sinked, and consider derating the power dissipation accordingly. Consult the datasheet for more information on temperature-related specifications.
  • To protect OPA317QDBVRQ1 from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the PCB layout is designed to minimize radiation and susceptibility to EMI.

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OPA317QDBVRQ1 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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