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OPA330AIDBVT - Texas Instruments

Description: Texas Instruments OPA330AIDBVT, Dual CMOS Op Amp, 350kHz Rail-Rail, 1.8 → 5.5 V, 5-Pin SOT-23

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PCB Footprints
OPA330AIDBVT - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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3D Models
OPA330AIDBVT - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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OPA330AIDBVT Details

  • Manufacturer Part Number:

    OPA330AIDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0005 µA

  • Bias Current-Max (IIB) @25C:

    0.0005 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    115 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.001 µA

  • Input Offset Voltage-Max:

    50 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    0.16 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA330AIDBVT Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA330AIDBVT is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper PCB layout practices, minimize parasitic capacitance, and use a compensation capacitor (if necessary) as recommended in the datasheet. Additionally, ensure that the feedback loop has a sufficient phase margin and gain margin.
  • While the OPA330AIDBVT can be used as a comparator, it's not recommended due to its relatively slow slew rate (0.5V/μs) and limited output current (±20mA). A dedicated comparator IC would be a better choice for most applications.
  • The OPA330AIDBVT has built-in ESD protection, but it's still essential to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap, mat, or workstation, and avoid touching the device's pins or exposed internal circuitry.
  • Follow the recommended layout and routing guidelines in the datasheet, including keeping the input and output traces short and symmetrical, using a ground plane, and minimizing noise coupling. Consult the TI application notes and layout guidelines for more information.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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