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OPA330AIDCKTG4 - Texas Instruments

Description: CMOS OPERATIONAL AMPLIFIERS

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PCB Footprints
OPA330AIDCKTG4 - Texas Instruments PCB footprint - Other - Other - SOT65P210X110-5N
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OPA330AIDCKTG4 - Texas Instruments  - 3D model - Other - SOT65P210X110-5N
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OPA330AIDCKTG4 Details

  • Manufacturer Part Number:

    OPA330AIDCKTG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOT

  • Package Description:

    SC-70, 5 PIN

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0005 µA

  • Bias Current-Max (IIB) @25C:

    0.0005 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    115 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.001 µA

  • Input Offset Voltage-Max:

    50 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.16 V/us

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.25 mm

OPA330AIDCKTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, which includes guidelines for component placement, trace routing, and thermal management. Additionally, the TI website has a PCB layout tool that can help with designing a layout for this op-amp.
  • The OPA330AIDCKTG4 has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent damage. Use an anti-static wrist strap or mat, and avoid touching the device pins. For added protection, consider using ESD-protection diodes or resistors in the circuit.
  • The maximum power dissipation for the OPA330AIDCKTG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C. However, it's essential to calculate the power dissipation based on the specific application and thermal conditions.
  • The OPA330AIDCKTG4 is rated for operation up to 125°C, but its performance may degrade at higher temperatures. It's essential to consider the temperature coefficient of the op-amp's parameters, such as gain bandwidth and input offset voltage, when designing for high-temperature applications.
  • The output capacitor selection depends on the specific application, output current, and stability requirements. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, and a voltage rating that exceeds the output voltage. It's also important to consider the capacitor's ESR and ESL when selecting a component.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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