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OPA330AIYFFR - Texas Instruments

Description: 1.8V, 35µA, microPower, Precision, Zero Drift CMOS Op Amp

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OPA330AIYFFR - Texas Instruments PCB footprint - Other - Other - OPA330AIYFFR-2
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OPA330AIYFFR - Texas Instruments  - 3D model - Other - OPA330AIYFFR-2
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OPA330AIYFFR Details

  • Manufacturer Part Number:

    OPA330AIYFFR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    5

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0005 µA

  • Bias Current-Max (IIB) @25C:

    0.0005 µA

  • Common-mode Reject Ratio-Min:

    100 dB

  • Common-mode Reject Ratio-Nom:

    115 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0006 µA

  • Input Offset Voltage-Max:

    50 µV

  • JESD-30 Code:

    R-PBGA-B5

  • JESD-609 Code:

    e1

  • Length:

    1 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA5,3X3,14/8

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.625 mm

  • Slew Rate-Nom:

    0.16 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    0.035 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.293 mm

OPA330AIYFFR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA330AIYFFR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain resistors are properly matched, and the feedback network is properly compensated. Also, avoid using long input traces and keep the input impedance low to minimize oscillations.
  • The maximum power dissipation of OPA330AIYFFR is 750mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. Ensure proper heat sinking and thermal management to prevent overheating.
  • Yes, OPA330AIYFFR is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature should not exceed 150°C.
  • Use proper ESD handling procedures when handling OPA330AIYFFR, such as using an ESD wrist strap or mat. Also, ensure that the PCB has proper ESD protection circuitry, such as TVS diodes or ESD protection arrays.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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