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OPA333AIDG4 - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA333AIDG4 - OP AMP, 350KHZ, 0.16V/US, 2UV, SOIC-8

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OPA333AIDG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - OPA333AIDG4_11
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OPA333AIDG4 Details

  • Manufacturer Part Number:

    OPA333AIDG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    106 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.16 V/us

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    350

  • Voltage Gain-Min:

    200000

  • Wideband:

    NO

  • Width:

    3.9 mm

OPA333AIDG4 Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the OPA333AIDG4 is 440mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • The OPA333AIDG4 is specified to operate from -40°C to 125°C, but it's not recommended to operate it at the maximum temperature for extended periods. The device's performance and reliability may degrade at high temperatures.
  • To minimize noise and ensure good performance, follow good PCB layout practices such as separating analog and digital grounds, using a solid ground plane, and keeping sensitive analog signals away from noisy digital signals. Also, place the OPA333AIDG4 close to the signal sources and use short, direct traces to minimize parasitic inductance and capacitance.
  • Yes, the OPA333AIDG4 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is high enough to avoid loading the source, and the output impedance is low enough to drive the load. Also, consider the op-amp's bandwidth and slew rate to ensure they meet the requirements of your application.
  • Choose bypass capacitors with a low equivalent series resistance (ESR) and a high self-resonant frequency (SRF) to ensure they can effectively filter out high-frequency noise. A 10nF to 100nF ceramic capacitor is a good starting point, but the optimal value depends on the specific application and PCB layout.

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OPA333AIDG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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