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OPA335AIDBVTG4 - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA335AIDBVTG4 - Operational Amplifier, Single, 1 Amplifier, 1 MHz, 1.6 V/µs, ± 1.35V to ± 2.75V, SOT-23, 5 Pins

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PCB Footprints
OPA335AIDBVTG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA335AIDBVTG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA335AIDBVTG4 Details

  • Manufacturer Part Number:

    OPA335AIDBVTG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.0004 µA

  • Input Offset Voltage-Max:

    5 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    1.6 V/us

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2000

  • Voltage Gain-Min:

    316000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA335AIDBVTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic capacitance and inductance, with a solid ground plane and short traces. A 4-layer PCB with a dedicated analog ground plane is recommended. See the TI application note 'AN-1187: PCB Layout Guidelines for OPA335' for more details.
  • The OPA335AIDBVTG4 has internal ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-free environment.
  • The maximum power dissipation for OPA335AIDBVTG4 is 500mW. However, this can be limited by the thermal resistance of the package and the PCB. Ensure that the device is properly heat-sinked and that the thermal resistance is minimized.
  • The OPA335AIDBVTG4 is specified to operate from -40°C to 125°C. However, the device's performance may degrade at high temperatures. Ensure that the device is properly heat-sinked and that the thermal resistance is minimized to prevent overheating.
  • The input and output capacitors should be selected based on the frequency response and impedance requirements of the application. A general rule of thumb is to use capacitors with a low equivalent series resistance (ESR) and a high self-resonant frequency. See the TI application note 'AN-1205: Capacitor Selection for OPA335' for more details.

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OPA335AIDBVTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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