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OPA337NA/3KG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps MicroSIZE Sngl-Sply CMOS

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OPA337NA/3KG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A  HEIGHT 1.45
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OPA337NA/3KG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A  HEIGHT 1.45
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OPA337NA/3KG4 Details

  • Manufacturer Part Number:

    OPA337NA/3KG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA337NA/3KG4 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA337NA/3KG4 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. TI provides a recommended layout in the datasheet and application notes.
  • The choice of gain resistors depends on the desired gain, input impedance, and noise requirements. TI provides a gain resistor calculator tool and application notes to help with the selection. Generally, it's recommended to use 1% or 0.1% tolerance resistors to ensure accuracy and stability.
  • The maximum power dissipation of OPA337NA/3KG4 is dependent on the ambient temperature and package type. For the DIP package, the maximum power dissipation is 720mW at 25°C. For the SOT23 package, it's 440mW at 25°C. See the datasheet for more information on power dissipation and thermal characteristics.
  • Yes, OPA337NA/3KG4 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance, and the output is properly terminated to prevent oscillations. TI provides application notes and examples for unity-gain buffer configurations.
  • To protect OPA337NA/3KG4 from ESD and overvoltage, use ESD protection diodes, such as the TI TPD1E10B06, and consider adding input protection resistors and capacitors. Additionally, ensure that the power supply is well-regulated and filtered to prevent voltage spikes and transients.

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OPA337NA/3KG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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