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OPA343NA/250G4 - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA343NA/250G4 - Operational Amplifier, 1 Amplifier, 5.5 MHz, 6 V/µs, 2.7V to 5V, SOT-23, 5 Pins

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OPA343NA/250G4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Pin SOT-23
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OPA343NA/250G4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - 5-Pin SOT-23
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OPA343NA/250G4 Details

  • Manufacturer Part Number:

    OPA343NA/250G4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00006 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    92 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    6 V/us

  • Supply Current-Max:

    1.25 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    40000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA343NA/250G4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic capacitance and inductance, keeps the input and output traces short and away from each other, and uses a solid ground plane to reduce noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain is set to a value that does not exceed the recommended maximum gain, and that the feedback network is properly designed to provide sufficient phase margin. Additionally, use a compensation capacitor if necessary, and avoid using long feedback traces.
  • The maximum power dissipation of OPA343NA/250G4 is 500mW. However, this value can be limited by the thermal resistance of the package and the PCB, so it's essential to ensure proper thermal management to prevent overheating.
  • Yes, OPA343NA/250G4 is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may need to be derated. Consult the datasheet for specific temperature-related limitations.
  • To protect OPA343NA/250G4 from ESD damage, use proper handling and storage procedures, such as using anti-static bags and wrist straps. Additionally, design the PCB with ESD protection in mind, including the use of TVS diodes and resistors to limit voltage transients.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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