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OPA353NA/250G4 - Texas Instruments

Description: IC OPAMP GP 44MHZ RRO SOT23-5

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PCB Footprints
OPA353NA/250G4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA353NA/250G4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA353NA/250G4 Details

  • Manufacturer Part Number:

    OPA353NA/250G4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    58 dB

  • Common-mode Reject Ratio-Nom:

    86 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    22 V/us

  • Supply Current-Max:

    9 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    44000

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA353NA/250G4 Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to ensure high-frequency stability and low noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • TI recommends using ESD protection devices such as TVS diodes or ESD arrays at the input and output pins of the OPA353NA/250G4. Additionally, handling the device by the body or using an anti-static wrist strap can prevent ESD damage.
  • The maximum power dissipation of OPA353NA/250G4 is 500mW. However, this can be limited by the thermal resistance of the package and the PCB. TI recommends using a heat sink or a thermally enhanced package to ensure reliable operation.
  • Yes, OPA353NA/250G4 is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum junction temperature should not exceed 150°C. TI recommends derating the power dissipation and using a heat sink to ensure reliable operation.
  • TI recommends using low-ESR, high-frequency capacitors with a value of 10nF to 100nF for input and output decoupling. The capacitor selection should be based on the specific application requirements, such as noise filtering and stability.

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OPA353NA/250G4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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