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OPA354AIDBVTG4 - Texas Instruments

Description: TEXAS INSTRUMENTS - OPA354AIDBVTG4 - OP AMP, CMOS 250MHZ RRI/O, SOT-23-5

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PCB Footprints
OPA354AIDBVTG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA354AIDBVTG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA354AIDBVTG4 Details

  • Manufacturer Part Number:

    OPA354AIDBVTG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bandwidth (3dB)-Nom:

    90 MHz

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    8000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    150 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100000

  • Voltage Gain-Min:

    94

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA354AIDBVTG4 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA354AIDBVTG4 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain is set to a value that does not exceed the recommended maximum gain, and that the feedback resistors are chosen to minimize phase shift. Additionally, adding a capacitor in parallel with the feedback resistor can help improve stability.
  • The recommended power-on sequence for OPA354AIDBVTG4 is to apply the power supply voltage (VCC) before applying the input signal. This helps to prevent unwanted output voltage transients during power-up.
  • To handle ESD protection, use ESD protection diodes or TVS diodes on the input pins, and ensure that the PCB layout is designed to minimize ESD susceptibility. Additionally, handle the device by the body or use an anti-static wrist strap to prevent ESD damage during handling.
  • The recommended thermal management strategy for OPA354AIDBVTG4 involves using a heat sink or thermal pad to dissipate heat, and ensuring good airflow around the device. The device should be mounted on a PCB with a solid ground plane to help dissipate heat.

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OPA354AIDBVTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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