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OPA355NA/3K - Texas Instruments

Description: 2.5V, 200MHz GBW, CMOS Single Op Amp With Shutdown

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PCB Footprints
OPA355NA/3K - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006A HEIGHT 1.45-2
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3D Models
OPA355NA/3K - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006A HEIGHT 1.45-2
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OPA355NA/3K Details

  • Manufacturer Part Number:

    OPA355NA/3K

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    66 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    300 V/us

  • Supply Current-Max:

    11 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    200000

  • Voltage Gain-Min:

    10000

  • Wideband:

    YES

  • Width:

    1.6 mm

OPA355NA/3K Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA355NA/3K involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended layout in the datasheet.
  • Choose gain resistors based on the desired gain and bandwidth requirements. TI provides a gain resistor calculator tool to help with this. Additionally, consider the resistor's tolerance, temperature coefficient, and power rating.
  • The maximum power dissipation of OPA355NA/3K is 670mW. However, this can be affected by the ambient temperature, PCB layout, and thermal resistance. Ensure proper thermal management to prevent overheating.
  • OPA355NA/3K is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. Consider using a thermally enhanced package or a heat sink to mitigate temperature-related issues.
  • Use proper shielding, grounding, and filtering techniques to minimize EMI effects. Place the device in a shielded enclosure, use a common-mode choke, and add EMI filters to the input and output lines.

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OPA355NA/3K Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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