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OPA357AIDDA - Texas Instruments

Description: OP Amp Single Volt Fdbk R-R I/O 5.5V

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OPA357AIDDA - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DDA (R-PDSO-G8)-ren1
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OPA357AIDDA - Texas Instruments  - 3D model - Small Outline Packages - DDA (R-PDSO-G8)-ren1
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OPA357AIDDA Details

  • Manufacturer Part Number:

    OPA357AIDDA

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.68 mm

  • Slew Rate-Nom:

    150 V/us

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    7.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100000

  • Voltage Gain-Min:

    31622.77

  • Wideband:

    YES

  • Width:

    3.9 mm

OPA357AIDDA Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA357AIDDA involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the power pins. Additionally, it's recommended to use a symmetrical layout to minimize thermal gradients and noise.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements of your application. A good starting point is to use the gain resistor values recommended in the datasheet, and then adjust them based on your specific requirements. It's also important to consider the resistor's tolerance, temperature coefficient, and parasitic capacitance.
  • The maximum power dissipation of OPA357AIDDA is limited by its junction temperature, which should not exceed 150°C. To calculate the power dissipation, you need to consider the output current, voltage, and package thermal resistance. A good rule of thumb is to keep the power dissipation below 500mW to ensure reliable operation.
  • To protect OPA357AIDDA from EMI, use a shielded enclosure, keep the input and output traces short, and use a common-mode choke or ferrite bead on the input lines. Additionally, consider using a low-pass filter or a shielding material around the device to reduce radiated emissions.
  • The recommended operating voltage range for OPA357AIDDA is 2.7V to 5.5V. Operating the device outside this range may affect its performance, stability, and reliability. It's also important to ensure that the voltage supply is clean and well-regulated to minimize noise and distortion.

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OPA357AIDDA Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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