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OPA358AIDCKR - Texas Instruments

Description: High Speed Operational Amplifiers 3V Single Supply 80MHz High-Speed

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OPA358AIDCKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DCK (R-PDSO-G6)-2
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OPA358AIDCKR - Texas Instruments  - 3D model - Small Outline Packages - DCK (R-PDSO-G6)-2
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OPA358AIDCKR Details

  • Manufacturer Part Number:

    OPA358AIDCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    80 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    6000 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    55 V/us

  • Supply Current-Max:

    7.5 mA

  • Supply Voltage Limit-Max:

    3.6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    80000

  • Voltage Gain-Min:

    15848.931

  • Wideband:

    YES

  • Width:

    1.25 mm

OPA358AIDCKR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA358AIDCKR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, ensure that the gain resistor (Rg) is less than or equal to 1 kΩ, and the feedback capacitor (Cf) is less than or equal to 10 pF. Also, use a low-ESR capacitor for decoupling and keep the layout compact.
  • The maximum power dissipation of OPA358AIDCKR is 670 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • Yes, OPA358AIDCKR is rated for operation up to 125°C. However, the device's performance may degrade at high temperatures, and the maximum power dissipation may be limited. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • To protect OPA358AIDCKR from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input lines. Also, ensure that the PCB layout is compact and the device is properly decoupled.

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OPA358AIDCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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