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OPA363IDBVT - Texas Instruments

Description: OPA363IDBVT, Operational Amplifier 7MHz CMOS, R-R, 3, 5V, 6-Pin SOT-23

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OPA363IDBVT - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DBV0006_A
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OPA363IDBVT - Texas Instruments  - 3D model - SOT23 (6-Pin) - DBV0006_A
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OPA363IDBVT Details

  • Manufacturer Part Number:

    OPA363IDBVT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-23

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    1

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    19950

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA363IDBVT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout that minimizes parasitic inductance and capacitance, with a solid ground plane, and keeping the input and output traces short and away from each other. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended compensation network, and ensure that the gain resistor (Rg) is properly sized. A general rule of thumb is to keep Rg < 1kΩ. Additionally, the output capacitor (Cout) should be chosen to ensure a phase margin of at least 45°.
  • The maximum power dissipation of OPA363IDBVT is 750mW. To calculate the power dissipation, use the formula: Pd = (Vcc x Icc) + (Vout x Iout), where Vcc is the supply voltage, Icc is the quiescent current, Vout is the output voltage, and Iout is the output current.
  • Yes, OPA363IDBVT is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management and heat sinking to prevent overheating.
  • To protect OPA363IDBVT from EMI, use a shielded enclosure, and ensure that the PCB layout is designed to minimize radiation. Additionally, use bypass capacitors (e.g., 10nF) on the power supply lines, and consider adding EMI filters or common-mode chokes to the input and output lines.

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OPA363IDBVT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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