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OPA364IDBVR - Texas Instruments

Description: 1.8V, High CMR, RRIO Op Amp

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PCB Footprints
OPA364IDBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA364IDBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA364IDBVR Details

  • Manufacturer Part Number:

    OPA364IDBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    74 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    5 V/us

  • Supply Current-Max:

    0.75 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    3.6 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    7000

  • Voltage Gain-Min:

    19950

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA364IDBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA364IDBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • The gain resistors (Rf and Rg) should be chosen based on the desired gain and bandwidth of the amplifier. A good starting point is to use the gain equation provided in the datasheet and then adjust the values based on the specific application requirements.
  • The maximum power dissipation of OPA364IDBVR is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 750mW at 25°C ambient temperature.
  • Yes, OPA364IDBVR is rated for operation from -40°C to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and heat dissipation in the system design.
  • To protect OPA364IDBVR from EMI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the input and output lines. Additionally, use a low-pass filter or a shielded cable to reduce radiated emissions.

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OPA364IDBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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