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OPA3690IDBQT - Texas Instruments

Description: Triple, Wideband, Voltage-Feedback Operational Amplifier with Disable

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OPA3690IDBQT - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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OPA3690IDBQT - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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OPA3690IDBQT Details

  • Manufacturer Part Number:

    OPA3690IDBQT

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    13 µA

  • Bias Current-Max (IIB) @25C:

    11 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    65 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    1 µA

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    500 V/us

  • Slew Rate-Nom:

    1800 V/us

  • Supply Current-Max:

    17.4 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    500000

  • Voltage Gain-Min:

    794.328

  • Wideband:

    YES

  • Width:

    3.895 mm

OPA3690IDBQT Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a layout with a solid ground plane, short traces, and minimal impedance mismatch to ensure high-frequency stability and low noise. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The output filter should be chosen based on the specific application requirements. A simple RC filter with a 1kΩ resistor and 10nF capacitor is a good starting point. For more complex filtering, a 2nd-order Butterworth filter or a Bessel filter can be used.
  • The OPA3690IDBQT can drive up to 1nF of capacitive load. However, it's recommended to limit the capacitive load to 100pF or less to ensure stability and prevent oscillations.
  • To reduce noise and EMI, use a low-noise power supply, decouple the power pins with 10uF and 100nF capacitors, and use a shielded enclosure. Additionally, keep the analog and digital grounds separate and use a star-grounding configuration.
  • The OPA3690IDBQT has a thermal derating of 13.9mW/°C above 25°C. This means that the maximum power dissipation decreases by 13.9mW for every degree Celsius above 25°C.

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OPA3690IDBQT Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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