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OPA3692IDBQR - Texas Instruments

Description: Op Amp Triple Buffer Amplifier ±6V/12V 16-Pin SSOP T/R

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OPA3692IDBQR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DBQ0016A
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OPA3692IDBQR - Texas Instruments  - 3D model - Small Outline Packages - DBQ0016A
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OPA3692IDBQR Details

  • Manufacturer Part Number:

    OPA3692IDBQR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    BUFFER

  • Average Bias Current-Max (IIB):

    56 µA

  • Bandwidth (3dB)-Nom:

    140 MHz

  • Bias Current-Max (IIB) @25C:

    20 µA

  • Input Offset Voltage-Max:

    2500 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -6.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Min:

    -10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Min:

    1350 V/us

  • Slew Rate-Nom:

    2100 V/us

  • Supply Current-Max:

    15.3 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

OPA3692IDBQR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA3692 datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, TI recommends using a 4-layer PCB with a solid ground plane and a separate analog ground plane to minimize noise and interference.
  • To ensure stability, follow the recommended compensation network and component values provided in the datasheet. Additionally, ensure that the circuit layout is well-designed, with minimal parasitic capacitance and inductance. Also, consider using a phase margin analyzer tool to verify the stability of your circuit.
  • The maximum power dissipation of OPA3692IDBQR is dependent on the ambient temperature and the package thermal resistance. The datasheet provides a formula to calculate the maximum power dissipation, which is PDMAX = (TJMAX - TA) / θJA, where TJMAX is the maximum junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance.
  • The OPA3692IDBQR is specified to operate from -40°C to 125°C. However, the device's performance and reliability may degrade at higher temperatures. TI recommends derating the device's power dissipation and ensuring proper thermal management to prevent overheating. Additionally, consider using a thermally enhanced package or a heat sink to reduce the junction temperature.
  • The datasheet provides guidelines for selecting input and output capacitors, including the recommended capacitor values and types. In general, choose capacitors with low equivalent series resistance (ESR) and high ripple current ratings to minimize noise and ensure stable operation.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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