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OPA376AIDBVRG4 - Texas Instruments

Description: OP Amp Single GP R-R O/P ±2.75V/5.5V 5-Pin SOT-23 T/R

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PCB Footprints
OPA376AIDBVRG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV0005A
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3D Models
OPA376AIDBVRG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV0005A
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OPA376AIDBVRG4 Details

  • Manufacturer Part Number:

    OPA376AIDBVRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00001 µA

  • Bias Current-Max (IIB) @25C:

    0.00001 µA

  • Common-mode Reject Ratio-Min:

    76 dB

  • Common-mode Reject Ratio-Nom:

    90 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00001 µA

  • Input Offset Voltage-Max:

    25 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    2 V/us

  • Supply Current-Max:

    0.95 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    2.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5500

  • Voltage Gain-Min:

    1000000

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA376AIDBVRG4 Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA376AIDBVRG4 involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • To ensure stability, ensure that the gain resistor (Rg) is less than or equal to 1 kΩ, and the feedback capacitor (Cf) is less than or equal to 10 pF. Also, use a low-ESR capacitor for decoupling and keep the layout compact to minimize parasitic inductance.
  • The maximum power dissipation of OPA376AIDBVRG4 is 750 mW. However, this can be limited by the thermal resistance of the package and the ambient temperature. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range.
  • While OPA376AIDBVRG4 is specified for operation up to 125°C, its performance may degrade at high temperatures. Ensure that the device is properly heat-sinked and the ambient temperature is within the recommended range. Consult the datasheet for temperature-related specifications and limitations.
  • To protect OPA376AIDBVRG4 from EMI, use a shielded enclosure, keep the device away from noise sources, and use a common-mode choke or ferrite bead on the input lines. Also, ensure that the PCB layout is compact and well-shielded.

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OPA376AIDBVRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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