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OPA379AIDCKTG4 - Texas Instruments

Description: Operational Amplifiers - Op Amps 1.8V 2.9uA 90kHz Rail-to-Rail I/O Op

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PCB Footprints
OPA379AIDCKTG4 - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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3D Models
OPA379AIDCKTG4 - Texas Instruments  - 3D model - SOT23 (5-Pin) - DCK (R-PDSO-G5)
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OPA379AIDCKTG4 Details

  • Manufacturer Part Number:

    OPA379AIDCKTG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.00005 µA

  • Common-mode Reject Ratio-Min:

    90 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.00005 µA

  • Input Offset Voltage-Max:

    1500 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    0.03 V/us

  • Supply Current-Max:

    0.0055 mA

  • Supply Voltage Limit-Max:

    7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    90

  • Voltage Gain-Min:

    100000

  • Wideband:

    NO

  • Width:

    1.25 mm

OPA379AIDCKTG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the OPA379 datasheet, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The output capacitor should be chosen based on the desired output impedance, stability, and noise performance. A general rule of thumb is to use a capacitor with a value between 10nF to 100nF, and a voltage rating that exceeds the maximum output voltage of the op-amp.
  • The maximum power dissipation of OPA379AIDCKTG4 is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C, but this can be derated to 0.7W at 85°C.
  • Yes, OPA379AIDCKTG4 is rated for operation from -40°C to 125°C, making it suitable for high-temperature environments. However, the device's performance and reliability may be affected at extreme temperatures, and the maximum power dissipation should be derated accordingly.
  • To ensure EMC with OPA379AIDCKTG4, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as necessary. Additionally, ensure that the device is properly bypassed and decoupled to minimize noise and radiation.

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OPA379AIDCKTG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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