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OPA387DBVR - Texas Instruments

Description: Precision Amplifiers Ultra-high precision (2 uV), zero-drift (0.003 uV/C), low-input-bias-current op amp (single)

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PCB Footprints
OPA387DBVR - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV
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3D Models
OPA387DBVR - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV
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OPA387DBVR Details

  • Manufacturer Part Number:

    OPA387DBVR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0002 µA

  • Bias Current-Max (IIB) @25C:

    0.00015 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    150 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    2 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Neg Supply Voltage Limit-Max:

    -3 V

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    2.8 V/us

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage Limit-Max:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    5700

  • Voltage Gain-Min:

    1778279

  • Wideband:

    NO

  • Width:

    1.6 mm

OPA387DBVR Frequently Asked Questions (FAQs)

  • A good PCB layout for OPA387DBVR involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated analog ground plane is recommended.
  • The choice of gain resistors depends on the desired gain, bandwidth, and noise requirements. A good starting point is to use the gain resistor values recommended in the datasheet, and then adjust them based on the specific application requirements. It's also important to consider the resistor's tolerance, temperature coefficient, and parasitic capacitance.
  • The maximum power dissipation of OPA387DBVR is 750mW. To ensure you don't exceed it, calculate the power dissipation based on the output current, voltage, and package thermal resistance. Use thermal design and layout techniques such as heat sinks, thermal vias, and thermal pads to reduce the junction temperature.
  • Use a combination of passive and active filtering techniques, such as RC filters, ferrite beads, and shielding, to reduce noise and interference. Also, consider using a low-pass filter or a notch filter to remove specific frequency components. Additionally, ensure good PCB layout practices, such as separating analog and digital grounds, and using decoupling capacitors.
  • The recommended operating voltage range for OPA387DBVR is 2.7V to 5.5V. Operating the device outside this range may affect its performance, reliability, and lifespan.

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OPA387DBVR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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